Sn-Ag-Cu合金电沉积行为的研究  

Studies on electrodeposition behavior of Sn-Ag-Cu alloy

作　　者：安茂忠[1] 张锦秋[1] 

机构地区：[1]哈尔滨工业大学化工学院,哈尔滨150001

出　　处：《黑龙江大学自然科学学报》2008年第6期701-705,共5页Journal of Natural Science of Heilongjiang University

基　　金：国家自然科学基金资助项目(50774025);哈尔滨市科技攻关重点项目(2005AA5CG156)

摘　　要：Sn-Ag-Cu合金是一种熔点较低、润湿性和耐蚀性优良的可焊性镀层,可从弱酸性的甲磺酸盐-碘化物镀液中通过电沉积的方法获得。循环伏安曲线、极化曲线和交流阻抗谱等电化学测试以及X-射线荧光光谱(XRF)分析表明,在这种镀液中,Sn-Ag-Cu合金的共沉积类型为正则共沉积,随着镀液中Ag+和Cu2+离子浓度的增加,Sn-Ag-Cu合金镀层中Ag和Cu的含量迅速增加,且镀层中Ag和Cu的含量始终高于其在镀液中的含量。Sn-Ag-Cu合金的电沉积过程是不可逆过程,随着电极电势的负移,控制步骤由扩散过程控制向电化学过程控制转化。Sn - Ag - Cu alloy is a kind of solderable deposit having low melt point, excellent wettability and corrosion resistance, which electrodeposited from weakly acidic bath containing methylsulfonic acid salts and iodide. Cyclic vohammetry （ CV）, liner sweep voltammetry （ LSV）, electrochemical impedance spectroscopy （EIS） and X - ray photoelectron spectroscopy （XPS） were used to analyse the electrochemical behavior of Sn -Ag- Cu alloy. The results indicate that the electrodeposition of Sn - Ag - Cu alloy is canonical, the contents of Ag and Cu in the deposits increase with the increase of concentrations of Ag^＋ and Cu^2＋ in the baths and are higher than the contents of Ag and Cu in baths. The electrodeposition of Sn - Ag - Cu is irreversible, and the controlling step convert from diffusion to electrochemical reaction with cathodic polarization moving to more negative direction.

关 键 词：Sn-Ag-Cu合金 电沉积 正则共沉积 控制步骤 

分 类 号：TQ153.2[化学工程—电化学工业]