植酸自组装膜对白铜缓蚀作用的光电化学研究  

PHOTOELECTROCHEMICAL STUDY OF CORROSION PERFORMANCE OF SELF-ASSEMBLED MONOLAYER OF PHYTIC ACID ON Cu-Ni ALLOY B30

作　　者：徐群杰[1] 万宗跃[1,2] 费琳[1] 印仁和[2] 周小金[1] 

机构地区：[1]上海电力学院能源与环境工程学院上海高校电力腐蚀控制与应用电化学重点实验室,上海200090 [2]上海大学理学院化学系,上海200444

出　　处：《腐蚀科学与防护技术》2009年第2期167-169,共3页Corrosion Science and Protection Technology

基　　金：国家自然科学基金(No.20406009);上海市教委重点项目(No.06ZZ67);上海市科技攻关计划(No.062312045);厦门大学固体表面物理化学国家重点实验室开放课题(No.200512);上海市重点学科建设资助项目(P1304)

摘　　要：用动电位伏安法和光电化学方法研究了植酸自组装单分子膜(SAMs)对白铜B30的缓蚀作用.结果表明,植酸分子易在白铜B30表面形成稳定的植酸SAMs,光电化学测试白铜B30表面膜显示p-型光响应,光响应来自电极表面的Cu2O层,植酸SAMs的形成使其光响应明显减弱,有良好的缓蚀效果,这与交流阻抗得到的结论一致,同时微分电容曲线表明植酸SAMs的形成改变了电极双电层结构,使得电容值减小,其缓蚀机理为化学吸附过程.The corrosion inhibition of the self-assembled monolayer of phytic acid on Cu-Ni alloy B30 in a solution of 0. 075 moL/LNa2 B4O7 ＋ 0. 15 mol/L H3 BO3 with pH = 8.5 was investigated by cyclic voltammerry and photocnrrent response method. The results indicate that phytic acid is liable to interact with B30 resulting in formation of a complex on B30 surface with good resistance to rust and corrosion. The Cu-Ni alloy B30 electrode showed p-type photoresponse, which came from Cu20 layer on its surface. The photoresponse decreases greatly due to the formed SAMs of phytic acid, which thereby gives rise to better corrosion resistance. It is in good agreement with the result by EIS. The SAMs changed the structure of the double-electric-layer and made the capacitance of double-electric layer decrease obviously. It also shows that the inhibition mechanism of phytic acid is a chemical adsorption process.

关 键 词：植酸 自组装膜 白铜B30 光电化学 腐蚀 

分 类 号：TG174.4[金属学及工艺—金属表面处理]