W-Cu梯度功能材料的热物理性能  

Thermo-physical properties of W-Cu functionally gradient materials

作　　者：刘彬彬[1] 谢建新[2] 陈江华[1] 

机构地区：[1]湖南大学材料科学与工程学院,长沙410082 [2]北京科技大学材料科学与工程学院,北京100083

出　　处：《中国有色金属学报》2009年第3期538-542,共5页The Chinese Journal of Nonferrous Metals

基　　金：国家杰出青年科学基金资助项目(50125415)

摘　　要：对采用不同粒度配比和热压制备的W-Cu梯度功能材料的热物理性能进行研究。结果表明:梯度材料的整体热导率较高,达到226.4W/(m.K),高于过渡层W/Cu33的热导率,低于散热层W/Cu50的热导率;封接层具有低的线性热膨胀系数,αRT～100℃=6.82×10-6/℃满足与BeO基板材料封接匹配的要求;低温热条件下制备的W-Cu梯度功能材料各梯度层的热膨胀系数具有良好的可控性和可设计性能,其实测值与理论值十分接近,其误差值低于6%;耐热冲击温度达到800℃以上,热疲劳性能可达500℃水淬50次以上。The thermo-physical properties of W-Cu functionally gradient materials fabricated by the method of particle size adjustment combining with hot press were investigated. The results show that the W-Cu functionally gradient material has a high thermal conductivity as 226.4 W/（m.K）, which is higher than that of the transitional layer W/Cu33 and lower than that of the radiating layer, W/Cu50. The sealing layer has a low coefficient of thermal expansion （CTE）, αRT-100℃ = 6.82× 10^-6/℃ which can match well with the substrate BeO. The CTE of each graded layer by this method has good lesignability. The experimental value is close to the theoretical value, with error lower than 6%. The thermal shock temperature is higher than 800℃ and the thermal fatigue property is more than 50 times by quenching at 500 ℃.

关 键 词：W-CU复合材料 梯度功能材料 热导率 热压 

分 类 号：TB331[一般工业技术—材料科学与工程]