改性无醛大豆基胶粘剂的研究  

Study on modified formaldehyde-free adhesive based on soybean

作　　者：杨涛[1] 雷文[1] 王考将[1] 丁小燕[1] 景露[1] 马宏明[1] 

机构地区：[1]南京林业大学理学院,江苏南京210037

出　　处：《中国胶粘剂》2009年第3期40-43,共4页China Adhesives

基　　金：2008年南京林业大学大学生科技创新项目(200872)。

摘　　要：采用表面活性剂(A)改性豆粕的方法制备了无甲醛大豆基胶粘剂。研究了A的用量、热压时间和热压温度对大豆基胶粘剂胶合性能的影响,采用差示扫描量热(DSC)仪对大豆基胶粘剂的热性能进行了研究。研究结果表明,当w(A)=2.5%(相对于豆粕而言)、热压时间为15min和热压温度为140～160℃时,大豆基胶粘剂表现出最佳的胶合强度;其主要的热反应在160℃以下完成。The formaldehyde-free adhesive based on soybean was prepared with surface active agent（A） as modifier of bean dregs. The influences of A content,hot-pressing time and hot-pressing temperature were investigated on bonding performance of adhesive based on soybean. The thermal performance was characterized by differential scanning calorimetry （DSC）. The research results showed that the bonding strength was optimal and the main thermal reaction was completed under 160 ℃ for adhesive based on soybean when mass fraction of A was 2.5% in bean dregs,hot-pressing time was 15 min and hot-pressing temperature was between 140 ℃ and 160 ℃.

关 键 词：大豆基胶粘剂 改性 胶合强度 胶合工艺 热性能 

分 类 号：TQ432.73[化学工程]