蚀刻过程的流体力学分析  

Hydromechanical Analysis of Etching Process

作　　者：田玲 李志东 

机构地区：[1]广州市兴森电子有限公司,广东广州510730

出　　处：《印制电路信息》2009年第4期32-33,37,共3页Printed Circuit Information

摘　　要：文章在PCB蚀刻理论的基础上,对蚀刻过程进行了流体力学分析,分析了不同纵横比线间药水流动情况,以及纵横比与药水流动、扩散层厚度变化的关系等,并通过试验进行了验证,可为业界精细线路蚀刻制作提供一定价值的参考和借鉴。This article based on PCB etch theory has analyzed the hydromechanics of etch process. Furthermore, etch liquid flow in line space of different aspect ratio and the relationship of aspect ratio, liquid flow and diffuse layer thickness were been analyzed and confirmed by some trial. And it will be some significant to the facture of fine line.

关 键 词：蚀刻 纵横比 精细线路 流体力学 

分 类 号：TN41[电子电信—微电子学与固体电子学]