Bi-2223/Ag高温超导带材的有阻连接研究  

Resistant-joint fabrication of high temperature superconducting Bi-2223/Ag tapes

作　　者：邹贵生[1] 王延军[1] 吴爱萍[1] 郭伟[1] 白海林[1] 任家烈[1] 宋秀华 宗军 董宁波 张宏杰 王素丽 

机构地区：[1]清华大学机械工程系和教育部先进成形制造重点实验室,北京市100084 [2]北京英纳超导技术有限责任公司,100176

出　　处：《焊接》2009年第3期19-23,共5页Welding & Joining

基　　金：国家自然科学基金面上和重点项目(50575114和50635050);北京市自然科学基金项目(3052010)

摘　　要：采用低熔点63%Sn-34%Pb-1%Bi-2%Ag合金钎料膏软钎焊和不去除Ag合金包套的直接扩散连接两种方法进行Bi系超导带材的有阻连接。研究了搭接长度、钎焊保温时间、扩散连接温度对接头显微结构、临界电流和电阻的影响。工艺适当时,两种接头的电阻均能达到10^(18)Ω量级且临界电流较高。The resistant-joint fabrication technologies of high temperature superconducting Bi-2223/Ag tapes,including the soldering technology using the filler of 63% Sn-34% Pb-1% Bi-2% Ag paste and the direct pressing diffusion bonding technology at high temperature without removing the Ag-based alloy sheath,were performed.The effects of lapping length of joints,soldering holding time and diffusion bonding temperature on the microstructures,critical current and resistance of the joints were investigated.The results show that the resistance of the two types of joints can reach the order of 10^(-8) Ω with relatively high critical current.

关 键 词：BI-2223/AG带材 软钎焊 扩散连接 

分 类 号：TM26[一般工业技术—材料科学与工程]