0201/01005元件组装工艺技术研究  

Research of 0201/01005 assembly process

作　　者：鲜飞[1] 

机构地区：[1]烽火通信科技股份有限公司,湖北武汉430073

出　　处：《电子测试》2009年第4期53-56,共4页Electronic Test

摘　　要：当今元件封装技术正日新月异,以满足不断快速增长的电子产品的需求。0201/01005是现代电子组装技术的新概念,它能大幅度降低电子产品体积。在许多便携式产品中对形状的要求以及其它产品上以更小的面积实现更多功能的需求,使得0201封装受到人们的青睐。而01005则又上了一层楼,成为这场技术竞争的产物。0201/01005封装由于元件尺寸小,有许多专门的组装注意事项。本文从线路板设计、焊膏选择、贴装控制等几个方面浅谈0201/01005元件组装工艺技术。Nowadays, chip package technology are developing faster and faster in order to meet the need of rapid progress of electronic products. 0201/01005 package is a new concept of contemporary assembly technology,it can greatly reduce the volume of electronic products. In some portable product fields,more function need but based on less room. So the 0201/01005 is getting more and more application now. Due to its small size,0201/01005 package has special assembly considerations. The article introduces 0201/01005 assembly process, including PCB design, the selection of solder paste and placement control, etc.

关 键 词：0201/01005 线路板 吸取 贴装 元件 组装 

分 类 号：TN605[电子电信—电路与系统]