以酒石酸钠钾为络合剂的常温化学镀铜液研制  

Study of an electroless copper plating bath using potassium sodium tartrate as chleating agent

作　　者：周仲承 马斯才 易家香 高四 苏良飞 刘荣胜 

机构地区：[1]中南电子化学材料所

出　　处：《印制电路信息》2010年第S1期98-102,共5页Printed Circuit Information

摘　　要：常温化学镀铜溶液具有反应温度低、甲醛自我分解少、维护费用低等优点。为了寻找合适添加剂并确定各组份最佳含量,获得一种反应活性好,维护简单的沉铜液,文中通过设计七因素三水平正交实验的方法,综合研究了沉铜液中各组份对沉积速率、溶液稳定性、镀层外观的影响,确定了一种以酒石酸钠钾为络合剂,甲醛为还原剂,稳定性较好、沉积速率较高、镀层外观较好的常温化学镀铜配方。Electroless copper plating bath working at room temperature has the advantages of lower working temperature, lower decomposition rate of formaldehyde and lower cost for maintenance. In order to obtain good copper layer, different additives must be added to the copper plating bath. A perpendicular experiment with seven factors and three levels was done to select suitable additives and determine the content of each composite. The influence of the different content of each composite on the deposition rate, the stability of the bath and the appearance of the copper layer was also studied at the same time. From the results, the composition of the electroless copper plating bath was established. The bath works at room temperature and has good stability, suitable deposition rate. The copper layer generated from the bath has good appearance and high elongation.

关 键 词：常温化学镀铜 稳定性 沉积速率 镀层外观 

分 类 号：TQ153.14[化学工程—电化学工业]