化学沉镍金板线路阻焊剥离的原因探讨  

The factors research of the S/M peeling off during ENIG

作　　者：邹儒彬 

机构地区：[1]崇达多层线路板股份有限公司

出　　处：《印制电路信息》2010年第S1期152-159,共8页Printed Circuit Information

摘　　要：作为印制电路板表面处理的一种方式,化学沉镍金能起到保护焊接镀层并提供可导电、可焊接界面的功能,因而得到广泛应用。然其本身仍有一些难以消除的问题,其中就包括线路阻焊剥离。本文讨论导致化学沉镍金板线路阻焊剥离的因素,包括阻焊后固化的温度(T)和时间(t)、油墨厚度(H)、油墨特性、沉镍金参数和沉镍金药水特性的影响。文章最后讲述一些基于作者经验的消除化学沉镍金板线路阻焊剥离的相对有效的措施。As one of the surface final finish for printed circuit board(PCB),providing a protective,conductive and solderable surface,Electroless nickel/immersion gold(ENIG) technology is widely used.However,some problems are hard to be eliminated,besides the solder mask on circuit peeling off.In this paper,the factors of the solder mask(S/M) on circuit peeling off in the process of the Electroless Ni/Immersion Au(ENIG) were discussed,including temperature and time of post cure,the thickness ofink,the characteristics of ink,parameter of ENIG,and the characteristics of ENIG solution.And the relative effective actions which were based on the author's experience to eliminate it were narrated at the end.

关 键 词：化学沉镍金 线路阻焊剥离 后固化温度和时间 油墨厚度 油墨特性 沉镍金参数 沉镍金药水特性 

分 类 号：TN41[电子电信—微电子学与固体电子学]