Research Progress in Solderable Black Pad of Electroless Nickel/Immersion Gold  

作　　者：刘海萍 李宁 毕四富 黎德育 

机构地区：[1]Department of Applied Chemistry, Harbin Institute of Technology

出　　处：《Journal of Rare Earths》2007年第S2期308-312,共5页稀土学报（英文版）

基　　金：Project supported by the Specialized Research Fund for the Doctoral Programof Higher Education (20030213007);the Heilongjiang Province Natural Science Foundation (E0325)

摘　　要：Electroless nickel/immersion gold (ENIG) technology is widely used as one of the surface final finish for electronics packaging substrate and printed circuit board (PCB), providing a protective, conductive and solderable surface. However, there is a solder joint interfacial brittle fracture (or solderability failure) of using the ENIG coating. The characteristics and the application of ENIG technology were narrated in this paper. The research progress on the solderability failure of ENIG was introduced. The mechanism of 'black pad' and the possible measure of eliminating or alleviating the 'black pad' were also introduced. The development direction and market prospects of ENIG were prospected.Electroless nickel/immersion gold (ENIG) technology is widely used as one of the surface final finish for electronics packaging substrate and printed circuit board (PCB), providing a protective, conductive and solderable surface. However, there is a solder joint interfacial brittle fracture (or solderability failure) of using the ENIG coating. The characteristics and the application of ENIG technology were narrated in this paper. The research progress on the solderability failure of ENIG was introduced. The mechanism of 'black pad' and the possible measure of eliminating or alleviating the 'black pad' were also introduced. The development direction and market prospects of ENIG were prospected.

关 键 词：electroless nickel immersion gold (ENIG) solderability failure black pad 

分 类 号：O646[理学—物理化学]