无铅焊接技术对印制电路板可靠性的影响  

Effect of Lead-Free Soldering Technology on the Reliability of PCB

作　　者：李小侠[1] 朱荣林[1] 

机构地区：[1]上海航天局813所,上海200086

出　　处：《上海交通大学学报》2007年第S2期95-99,105,共6页Journal of Shanghai Jiaotong University

摘　　要：阐述了无铅焊接中焊料及其工艺特点,并与有铅焊接进行了比较.分别通过SMT再流焊接和手工焊接陈述了无铅焊接技术在军品上的应用,论述了无铅(混合)焊接对PCB可靠性的影响.The characteristic of lead free solder and soldering process was expounded,and compared with traditional Pb-contained soldering.The application of lead-free soldering in military equipment was stated by SMT and ironing soldering.Lastly,the effect of lead-free soldering on the reliability of PCB was discussed.

关 键 词：印制电路板 无铅 焊接 可靠性 

分 类 号：TN41[电子电信—微电子学与固体电子学]