Test research and mechanism analysis of vacuum fluxless laser soldering for SMD  

作　　者：冯武锋 王春青 李明雨 孙福江 

出　　处：《China Welding》1998年第2期62-70,共9页中国焊接（英文版）

基　　金：This project is subsidized by Natural Science Funds of Naion.The authorized number is 59671063.

摘　　要：Fluxless soldering can solve a series of problems caused by side-effects afflux essentially. Feasibility research on vacuum fluxless laser soldering and mechanism analysis on fluxless action of vacuum were carried out. Fluxless soldering succeeded in spreading and wetting on Cu pad with laser heating source in vacuum surroundings. What' s more, this fluxless technology was applied in surface mounting of chip resistance successfully.Fluxless soldering can solve a series of problems caused by side-effects afflux essentially. Feasibility research on vacuum fluxless laser soldering and mechanism analysis on fluxless action of vacuum were carried out. Fluxless soldering succeeded in spreading and wetting on Cu pad with laser heating source in vacuum surroundings. What' s more, this fluxless technology was applied in surface mounting of chip resistance successfully.

关 键 词：VACUUM fluxless soldering LASER SMD (Surface Mount Device) 

分 类 号：TG456.7[金属学及工艺—焊接]