Mo粉表面化学镀Cu及其反应机理  

ELECTROLESS PLATING Cu ON Mo POWDER AND ITS REACTION MECHANISM

作　　者：王光君[1,2] 王德志[1,2] 周杰[1,2] 吴壮志[1,2] 徐兵[1,2] 

机构地区：[1]中南大学有色金属材料科学与工程教育部重点实验室,长沙410083 [2]中南大学材料科学与工程学院,长沙410083

出　　处：《金属学报》2009年第4期405-409,共5页Acta Metallurgica Sinica

摘　　要：利用Sn-Pd催化体系在Mo粉表面化学镀Cu制备了Cu/Mo复合粉体,利用XRD,SEM,EDS和XPS对复合粉体的成分及形貌进行了分析.利用XPS分析了Mo粉表面化学镀Cu过程中不同阶段元素价态的变化.解释了化学镀Cu过程中纳米Pd粒子的形成及其对Cu沉积的催化作用.By using Sn-Pd catalyst system, the electroless plating Cu on the surface of Mo powder was performed to fabricate Cu/Mo composite powder. Composition, morphology and formation process of Cu/Mo particles were analyzed by XRD, SEM/EDS and XPS. The formation mechanism of Cu/Mo particles can be described as follows： the PdCl2 （activator） deposited on the surface of Mo particles firstly and then was reduced by SnCl2 （sensitizer） to nano Pd particles, which are the nucleation sites for Cu deposition, finally Cu coating formed.

关 键 词：化学镀Cu Mo粉 Cu/Mo复合粉体 反应机理 

分 类 号：TQ153.1[化学工程—电化学工业]