HEDP-ATMP-TTA缓蚀剂对HSn70-1A铜合金腐蚀行为的影响  

Effect of Inhibitior HEDP-ATMP-TTA on Corrosion of HSn70-1A Copper-alloy

作　　者：郑强[1] 阎利[1] 

机构地区：[1]安阳工学院建筑工程系,安阳455000

出　　处：《腐蚀与防护》2009年第4期276-278,共3页Corrosion & Protection

摘　　要：通过静态失重法、极化曲线法、电化学阻抗谱测定了HEDP-ATMP-TTA复配缓蚀剂在循环冷却水介质中硫酸盐还原菌(SRB)作用下对HSn70-1A铜合金的协同缓蚀作用,讨论了缓蚀剂浓度和SRB对铜合金腐蚀行为的影响。结果表明:当循环冷却水介质中加入该缓蚀剂后,可以改善SRB对HSn70-1A铜合金的侵蚀程度;随着缓蚀剂浓度的增加,合金腐蚀速率逐渐下降,缓蚀率逐渐提高。Synergistic effect of HEDP, ATMP and TTA on corrosion inhibition of HSn70-1A copper-alloy in the industrial recirculation cooling water inoculated with SRB was studied by means of weight loss method. electrochemical polarization and electrochemical impedance spectroscopy （EIS） techniques. It was found that there was a synergistic effect between HEDP, ATMP and TTA. The corrosion rate of HSn70-1A copper-alloy descended with enhancement of concentration of the corrosion inhibitor.

关 键 词：HSnT0—1A铜合金 硫酸盐还原菌 缓蚀剂 极化曲线 电化学阻抗谱 

分 类 号：TG174.42[金属学及工艺—金属表面处理]