激光烧结厚膜正温度系数热敏电阻浆料的研究  

Study of Laser Sintering of Thick-Film Positive Temperature Coefficient Thermistor Paste

作　　者：蔡志祥[1] 李祥友[1] 胡乾午[1] 曾晓雁[1] 

机构地区：[1]华中科技大学光电子科学与工程学院武汉光电国家实验室(筹)激光部,湖北武汉430074

出　　处：《中国激光》2009年第4期1011-1015,共5页Chinese Journal of Lasers

基　　金：国家863计划(2006AA04Z313);国家自然科学基金(50575086)资助课题

摘　　要：采用激光烧结厚膜电子浆料技术．在三氧化二铝陶瓷基板上制备厚膜正温度系数（PTC）热敏电阻。研究了激光工艺参数以及后续热处理温度对PTC热敏电阻线宽、形貌和性能的影响规律。激光烧结制得的厚膜PTC热敏电阻最小线宽为40μm．电阻温度系数（TCR）可达2965×10^-6／℃，其性能与传统的炉中烧结相当。激光功率密度和后续热处理温度对PTC热敏电阻方阻和电阻温度系数影响较大，并都存在一个最佳值。Thick-film positive temperature coefficient （PTC） thermistor on Al2O3 ceramic substrate was prepared by laser sintering of thick-film electronic paste. The effects of laser processing parameters and the temperature of post heat processing on thick-film PTC thermistor width, surface microstructure and performance were studied. The minimum linewidth of thick-film PTC thermistor by laser sintering is 40 μm. The temperature coefficients of resistivity （TCR） of PTC thermistor is around 2965 ×10^-6/℃ , and the performance is equivalent to traditional oven- fired electrical paste. The laser power density and the temperature of post heat processing have great effect on the sheet resistivity and TCR of PTC thermistor, and there exist optimum values for these parameters.

关 键 词：激光烧结 氧化铝基板 厚膜正温度系数热敏电阻浆料 方阻 电阻温度系数 

分 类 号：TM544[电气工程—电器] TN249[电子电信—物理电子学]