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机构地区:[1]中国电子科技集团公司第三十八研究所,安徽合肥230031
出 处:《电子机械工程》2009年第2期50-53,共4页Electro-Mechanical Engineering
摘 要:雷达产品所用某组件壳体结构复杂,气密性要求高,采用了较为先进的电子束焊接,但在实际生产中其成品率较低,文中对电子束焊接的主要影响因素——配合间隙、扫描参数及点焊方法进行了详细的分析,并提出了改进电子束焊接方法的具体措施。实践证明所采用的电子束改进方法是成功的,对类似问题的解决提供了有益的参考。Digital module is widely used in Radar system. In many cases, it's characterized by complex shape and high airproof capability. As a result, it is sealed by advanced EBW, but the percentage of finished product is very low in actual manufacturing. We analyze in detail the main technological factors-matching clearance, scan parameters and the techniques of spot welding, and introduce the methods being used to improve EBW techniques. These techniques had been put into practical use and proved to be successful. They can be of reference value for resolving similar problems.
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