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作 者:樊小勇[1,2] 庄全超[2] 魏国祯[2] 柯福生[2] 黄令[2] 董全峰[2] 孙世刚[2]
机构地区:[1]长安大学材料科学与工程学院,西安710061 [2]厦门大学化学化工学院化学系,固体表面物理化学国家重点实验室,福建厦门361005
出 处:《物理化学学报》2009年第4期611-616,共6页Acta Physico-Chimica Sinica
基 金:国家重点基础研究发展规划(973)项目(2009CB220102)资助
摘 要:以氢气泡为动力学模板电沉积获得多孔铜,并通过热处理增强其结构稳定性.进一步将多孔铜作为基底通过电沉积制备Cu-Sn合金负极.XRD结果给出其组成为Cu6Sn5合金,扫描电子显微镜(SEM)观察到Cu6Sn5合金电极为三维(3D)多孔结构.充放电结果指出,Cu6Sn5合金电极具有较好的充放电性能,其首次放电(嵌锂)和充电(脱锂)容量分别为735和571mAh·g-1,并且具有较好的容量保持率.运用电化学阻抗谱研究了Cu6Sn5合金电极在商业电解液中的界面特性.Porous Cu was fabricated by electrodeposition through a kinetic template of hydrogen bubbles. The product was subsequently annealed to increase its structural stability. The Cu-Sn alloy was then electrodeposited onto porous Cu which served as a current collector. X-ray diffraction (XRD) studies ascertained that the composition of the Cu-Sn alloy was Cu6Sn5 and scanning electron microscopy (SEM) investigations showed a three-dimensional (3D) porous structure of the electrode. The first charge/discharge capacities of the Cu6Sn5 alloy electrode were measured respectively at 735 and 571 mAh·g-1,and a good retention of the capacities has been determined. Interfacial properties of the Cu6Sn5 alloy electrode in a commercial electrolyte were also studied by electrochemical impedance spectroscopy (EIS).
关 键 词:多孔铜集流体 Cu6Sn5合金 锂离子电池 负极 电化学阻抗谱
分 类 号:TM912[电气工程—电力电子与电力传动]
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