表面组装中Ni颗粒增强无铅复合钎料热输入研究  

Composite Lead-Free Solder in Surface Mount

作　　者：聂京凯[1] 郭福[2] 韩钰[1] 李现兵[1] 徐德录[1] 陈新[1] 

机构地区：[1]中国电力科学研究院新材料应用技术研究所,北京100055 [2]北京工业大学材料科学与工程学院,北京100022

出　　处：《新技术新工艺》2009年第4期70-73,共4页New Technology & New Process

基　　金：北京市科技新星计划资助项目(2004B03)

摘　　要：重点研究Ni颗粒增强Sn-3.5Ag基复合钎料中的热输入。在先前的研究中用钎料熔点与加热的温度差ΔT以及在熔点以上保温时间t定义了热输入,研究中通过测量不同工艺条件下钎料的力学性能和热输入量的大小,分析得出钎料的力学性能与热输入量的大小有直接关系,而与工艺条件无关,随着热输入量的增加,钎料内部Ni颗粒周围的金属间化合物逐渐发展,从而影响钎料的性能,通过控制表面组装中的热输入量可以简单而直接的得到生产中需要的钎料力学性能,从而提高生产效率。The focus of this research is the thermal input of Ni particle reinforced Sn-3. SAg based composite Lead-free solder. In previous study we using the solder melting point and the heating temperature difference AT and the holding time t that above the melting point to define the heating input. By measuring the mechanical properties of solder and measurement of the heating input under the different process in studies, we draw the conclusion that the mechanical properties of solder respect to the measurement of the heating input and independent to the processing condition. Then the IMCs around Ni particles showed significant development with the increase of heating input. The mechanical property was determined by the IMC morphologies. Therefore the ideal mechanical property could he obtained by controlled the measurement of heating input in surface mount. The best shearing strength is 60.7MPa with the measurement of heating input 5.1.

关 键 词：复合钎料 表面组装 热输入量 剪切强度 

分 类 号：TG115.28[金属学及工艺—物理冶金]