航天器电子产品搭接电阻的控制与测量  

Control and Measure of Bonding Resistance for Spacecraft Electronic Product

作　　者：申坤[1] 

机构地区：[1]北京控制工程研究所,北京100190

出　　处：《航天制造技术》2009年第2期6-9,23,共5页Aerospace Manufacturing Technology

摘　　要：介绍了电磁兼容性技术在航天器电子产品中的应用,针对产品建造规范中搭接电阻和屏蔽的设计,从电气和机械设计、工艺各环节的设计以及产品实现等几个方面提出了搭接电阻的控制方法。同时,给出了为实现电阻搭接而进行的测量方法。The application of EMC technique in spacecraft electronic product is introduced. Aimed at the design of bonding resistance and shielding in the build criterion, the control methods are given for electric and mechanical design, process design and realization courses, as well as the measuring methods to achieve the bonding resistance.

关 键 词：搭接电阻 控制 测量 接地 屏蔽 

分 类 号：V443[航空宇航科学与技术—飞行器设计]