化学镀镍对铌镁酸铅多层瓷介电容器的影响  

Effect of electroless nickel plating on Pb(Mg 1/3 Nb 2/3 )O 3 based multilayer cramic capacitors.

作　　者：陈万平[1] 李龙土[1] 王雨[1] 齐建全[1] 桂治轮[1] 

机构地区：[1]清华大学材料科学与工程系

出　　处：《电子元件与材料》1998年第3期40-41,共2页Electronic Components And Materials

基　　金：国家"863"项目

摘　　要：研究了化学镀镍对铌镁酸铅多层瓷介电容器的影响及其机理。结果表明，化学镀镍以后许多样品因其绝缘电阻严重下降、介电损耗大幅度增加而失效。通过对比实验发现，这些样品的失效不是由于镀液的渗透引起的，而是与化学镀镍过程中的化学反应有关。提出了化学镀镍过程中产生的氢原子还原铌镁酸铅陶瓷的观点。经过一定温度的氧化热处理，失效样品的性能可以得到恢复。Effect of electroless nickel plating on Pb(Mg 1/3 Nb 2/3 )O 3 based multilayer ceramic capacitor is studied Many samples failed completely as insulation resistance decreased dramatically and dielectric loss increased considerably after electroless nickel plating. Comparison experiment results show that the failure is not caused by the permeation of plating solution but by the reaction happened in the electroless nickel plating. The failed samples could be restored by annealing in air at 600℃. It is concluded that when hydrogen atoms generated in electroless nickel plating diffuse into Pb(Mg 1/3 Nb 2/3 )O 3 ceramics, a reduction reaction happens and cause the failure.(5 refs )

关 键 词：化学镀 陶瓷电容器 电容器 

分 类 号：TM534.1[电气工程—电器]