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机构地区:[1]东南大学毫米波国家重点实验室,南京210096
出 处:《微波学报》2009年第2期1-5,共5页Journal of Microwaves
基 金:国家自然科学基金委创新群体基金资助(60621002)
摘 要:基于基片集成波导技术与标准单层印刷电路板工艺,设计并实现了W波段多波束缝隙阵列天线。首先,为实现W波段测试,利用全波仿真设计了SIW与标准金属波导间的垂直转接。其次,结合理论方法及利用全波仿真优化设计了基片集成波导缝隙阵列天线。多波束天线的馈电网络采用与天线共面的4×4的Butler矩阵,其中的耦合器和移相器也均采用基片集成波导技术设计。最后,给出W波段多波束天线整体仿真和测试结果,测试结果与仿真结果一致。测试结果与仿真结果表明,采用基片集成波导技术和低成本的单层印刷电路板工艺可以在毫米波较高频段实现多波束天线。Based on the substrate integrated waveguide (SIW) technology and the standard single-layer printed circuit board (PCB) process, a multi-beam slot array antenna at W-band is designed, fabricated and measured. For the measurement purpose, the vertical transition between SIW and the standard metallic wavegnide is designed using full-wave simulations in the first step. Secondly, the SIW slot array antenna is designed using the theoretical method as well as the full-wave simulations for optimization. The feeding network of the multi-beam antenna is realized by using a 4 × 4 Butler matrix on the same layer of the antenna, in which the couplers and phase smilers are all designed with the SIW technology. Finally, the simulated and measured results of the whole W-band multi-beam antenna are presented. The measured and the simulation results, which are in good agreement, indicate that the multi-beam antenna can be realized in relatively high frequency band of millimeter waves using the SIW technology and tow-cost single-layer PCB process.
分 类 号:TN821[电子电信—信息与通信工程]
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