固溶温度对Cu-Ni-Si合金性能的影响  

Effect of Solution Temperature on Properties of Cu-Ni-Si Alloy

作　　者：任伟[1] 贾淑果[1,2] 刘平[1] 宋克兴[1] 

机构地区：[1]河南科技大学材料学院,河南洛阳471003 [2]河南省有色金属材料科学与加工技术重点实验室,河南洛阳471003

出　　处：《热加工工艺》2009年第8期121-123,共3页Hot Working Technology

基　　金：国家高技术研究发展计划(863计划)(2006AA03Z528);河南科技大学科研专项基金资助项目(06-04);河南科技大学青年基金资助项目(2008QN002)

摘　　要：采用大气熔炼工艺制备了Cu-Ni-Si合金,研究了时效前后固溶温度对集成电路引线框架用Cu-Ni-Si合金显微硬度和电导率的影响,并且分析了在800℃固溶后时效对Cu-Ni-Si合金性能的影响。结果表明:时效前随固溶温度的升高,材料的显微硬度和电导率均是首先较快下降,之后又略有回升;Cu-Ni-Si合金经800℃固溶及450℃×8 h时效后,合金得到了良好综合性能,其显微硬度达到241 HV,电导率达到42.5%IACS。The Cu-Ni-Si alloy was prepared using atmosphere smelting method. The effects of solution temperature on microhardness and electrical conductivity of Cu-Ni-Si alloy were studied, and the effects of aging treatment on the properties of Cu-Ni-Si alloy after solution at 800 ℃ were analyzed. The results show that the microhardness and electrical conductivity decrease rapidly first and then increase slightly with the increase of the solution temperature. After solution at 800 ℃ and aging at 450 ℃ for 8 h, the Cu-Ni-Si alloy has the excellent property, the microhardness is up to 241 HV and electrical conductivity is up to 42.5%IACS.

关 键 词：CU-NI-SI合金 固溶温度 显微硬度 时效 引线框架 

分 类 号：TG156.94[金属学及工艺—热处理]