Z型光亮剂酸性镀铜工艺及机理研究  

Study on Technique and Electrochemical Mechanism of Acidic Copper Electroplating of Z-type Brightener

作　　者：吕重安[1,2] 郑雅杰[1] 

机构地区：[1]中南大学冶金科学与工程学院,湖南长沙410083 [2]大冶有色金属公司,湖北黄石435005

出　　处：《矿冶工程》2009年第2期70-74,共5页Mining and Metallurgical Engineering

基　　金：教育部广东省产学研重点项目(2007A090302068)

摘　　要：研究了Z型光亮剂作用下酸性光亮镀铜工艺及其电化学作用机理。Z型光亮剂酸性光亮镀铜体系适宜工艺条件为:H2SO4用量为160~220 g/L、CuSO4.5H2O用量为80~100 g/L、PEG-6000用量为0.400~0.500 g/L、C l-浓度为(40~80)×10-6、Z型光亮剂用量为8~12 m l/L、温度10~40℃、电流密度1~3.5 A/dm2。采用Z型光亮剂酸性镀铜,镀层结晶细致、光滑、平整,40℃时电流效率为98.7%,其电化学极化区间为-70.18^-201.4 mV,交换电流密度(io)为6.34×10-4A/cm2。电化学极化实验证明Z型光亮剂具有增大极化作用,有利于形成细晶和起到光亮作用。Technique and electrochemical mechanism of acidic copper electroplating of Z-type brightener were studied. The optimal conditions for acidic copper electroplating of the brightener are as the following： H2 SO4 160 -220 g/L, CuSO4 · 5H20 80 - 100 g/L, Z-type brightener 8 - 12 mL/L, PEG -6000 0. 400 -0. 500 g/L, Cl - （40 -80）×10^-6, temperature of plating bath 10 -40 ℃, current density 1 -3.5 A/dm^2. The copper film obtained by acidic copper electroplating of Z-type brightener is even and smooth due to fine crystallization. The current efficiency of copper plating is 98.7% at 40℃. The electrochemical polarization span and the exchange current density （i0 ）of Z-type brightener plating solution are -70.18 - -201.4 mV and 6.34×10^-4 A/cm^2 respectively. The electrochemical polarization test testifies that Z-type brightener has the functions of increasing electrochemical polarization, facilitating fine crystals＇ formation and brightening.

关 键 词：电镀 光亮剂 酸性镀铜 工艺 机理 

分 类 号：TG174[金属学及工艺—金属表面处理]