冷变形和热处理对单晶Cu键合丝性能影响  

Effects of Annealing and Drawing on Properties of Single Crystal Copper Bonding Wire

作　　者：丁雨田[1] 曹军[1] 胡勇[1] 寇生中[1] 许广济[1] 

机构地区：[1]兰州理工大学甘肃省有色金属新材料省部共建国家重点实验室,兰州730050

出　　处：《机械工程学报》2009年第4期83-88,共6页Journal of Mechanical Engineering

基　　金：甘肃省科技攻关资助项目(2GS064-A52-036-05)。

摘　　要：研究单晶Cu键合丝冷加工过程中的微观组织和性能,分析热处理温度和热处理时间对单晶Cu键合丝破断力、伸长率和电阻率的影响。通过对单晶Cu键合丝进行冷加工及热处理,试验结果表明冷加工后的单晶Cu键合丝具有致密的纤维组织结构,强度和电阻率得到提高,伸长率下降。随着退火时间和退火温度的增加,单晶Cu键合丝破断力降低,伸长率增加,电阻率呈下降趋势。对于φ0.025mm的单晶Cu键合丝,在退火温度为420℃,退火时间为2.4s时,单晶Cu键合丝具有高的伸长率和较高的破断力。在热处理过程中张力过大或环境条件不稳定会导致键合丝表面出现竹节状缺陷。经试验数据拟合,单晶Cu键合丝线径与退火温度、退火时间之间存在二次多项式函数关系。The microstructure and properties of successive cold processed single-crystal copper bonding wire are investigated. The effects of annealing temperature and annealing time on the break load, elongation and resistivity of single-crystal copper bonding wire are analyzed. It is found that the microstructure of as-drawing single-crystal copper bonding wire is fibrous texture and the break load and resistivity increase distinctly whereas elongation is decreased contrarily. The break load and resistivity have the same decrease trend with the increase of annealing time and annealing temperature but the elongation increase contrarily. The result shows that the optimum break load and elongation are obtained at 420 ℃ and 2.4 s annealing process especially forФ 0.025 mm single crystal copper bonding wire and the surface quality strongly depends on the annealing process and outer circumstance. The single crystal copper bonding wire＇s diameter has relationship with the annealing temperature and annealing time which accord with the quadratic function.

关 键 词：单晶 CU 键合丝 破断力 伸长率 电阻率 拟合 

分 类 号：TG249[金属学及工艺—铸造]