热疲劳对纳米结构强化的无铅焊点性能的影响  

Effect of Thermomechanical Fatigue on Properties of Lead-Free Solder Joint with Nano-Structured Reinforcements

作　　者：刘彬[1] 刘建萍[1] 高小雨[1] 邰枫[1] 夏志东[1] 郭福[1] 

机构地区：[1]北京工业大学材料科学与工程学院,电子组装研究与测试中心,北京100022

出　　处：《稀有金属》2009年第2期205-210,共6页Chinese Journal of Rare Metals

基　　金：北京市科技新星计划B类(2004B03);霍英东基金(104016)资助项目

摘　　要：研究了热疲劳对Sn-3.5Ag共晶钎料及其复合钎料的残余机械性能和显微组织变化的影响。通过向Sn-3.5Ag基体钎料中添加微量的不同种类的纳米级多面齐聚倍半硅氧烷(POSS)颗粒制成复合钎料。对接头在不同热疲劳曲线下进行热疲劳试验,通过力学性能试验和SEM分析了疲劳裂纹生长情况。结果表明,经不同周期热疲劳试验后,复合钎料接头表面损伤较Sn-3.5Ag钎焊接头得以明显改善,残余机械性能高于Sn-3.5Ag共晶钎料。The effect of thermomechanical fatigue on microstmcture evolution and mechanical properties of Sn-3. SAg and its new composite solder was studied. The composite solder was prepared by different nanosized polyhedral oligomeric silse squioxanes （POSS） particulates with the optimal weight fractions into Sn- 3. SAg solder. All the four types of solder joints were tested tigue under different thermal fatigue profiles. The fadamage was characterized in different cycles with SEM. Experimental results generally revealed that a significant improvement of thermal fatigue resistance was obtained in the POSS reinforced composite solder joints by less fatigue damage and enhanced residual joint strength compared with Sn-3.5Ag solder joint.

关 键 词：纳米尺寸 POSS增强颗粒 复合钎料 热疲劳 

分 类 号：TG425[金属学及工艺—焊接]