Cu-Al合金平板内氧化组织性能研究  

Microstructure and properties of Cu-Al alloy sheet after internal oxidation

作　　者：苏凡凡[1] 张旦闻[2] 赵冬梅[1] 任凤章[1] 田保红[1] 贾淑果[1] 

机构地区：[1]河南科技大学材料学院,河南洛阳471003 [2]洛阳理工学院机电学院,河南洛阳471023

出　　处：《材料热处理学报》2009年第2期101-104,共4页Transactions of Materials and Heat Treatment

基　　金：河南省重点攻关项目(50571035)

摘　　要：采用简化的内氧化工艺制备了Al2O3/Cu复合材料,研究不同内氧化时间(3～10h)及不同变形量(20%～80%)下的Al2O3/Cu复合材料的显微硬度和导电率,并对其显微组织进行了分析。结果表明:内氧化法制备的Al2O3/Cu复合材料中弥散分布着纳米级的Al2O3颗粒;复合材料的表面和内部的晶粒大小明显不同,表面晶粒较小(粒径10～30μm);冷加工变形量越大,Al2O3颗粒与位错的缠结越严重;经900℃内氧化制备的Al2O3/Cu复合材料具有良好的导电率和显微硬度。Al2O3/Cu composites were prepared by internal oxidation of Cu-Al alloy. The micro-tructure, microhardness and electrical conductivity of the Al2O3/Cu composites prepared with different internal oxidation time and deformation were examined. The results show that Al2O3 nanoparticles disperse in the Al2O3/Cu composites after internal oxidation of Cu-Al alloy. The sizes of grains are obviously different in surface layer compared with inside, the grain size of surface layer is smaller （about 10- 30μm）. With increasing of deformation, density of dislocations increases in the Al2O3/Cu sheets. Al2O3/Cu composites prepared by intemal oxidation of Cu-Al alloy at 900℃ have excellent electrical conductivity and high microhardness.

关 键 词：AL2O3/CU复合材料 内氧化法 弥散强化 导电率 显微硬度 

分 类 号：TG113[金属学及工艺—物理冶金] TB333[金属学及工艺—金属学]