二极管激光器阵列微通道冷却实验研究  

AN EXPERIMENTAL STUDY ON THE MICROCHANNEL COOLING OF A DIODE LASER ARRAY

作　　者：李志刚[1] 淮秀兰[1] 陶毓伽[1] 王立[2] 

机构地区：[1]中国科学院工程热物理研究所,北京100190 [2]北京科技大学机械工程学院,北京100083

出　　处：《工程热物理学报》2009年第5期817-820,共4页Journal of Engineering Thermophysics

基　　金：吴仲华奖励基金;国家自然科学基金(No.50676009)

摘　　要：针对某二极管激光器阵列现有冷却器的实际问题,设计并制作了一种铜基液冷微通道冷却器。采用细密的短微通道来代替原来较宽的长通道,大幅度提高了有限空间内的对流换热面积,并可充分利用入口效应来增强换热,从而在保持较低流动阻力、较高流体流量和较低流体温升的前提下,显著提高了冷却器整体冷却能力,并改善了冷却器与热源器件界面上的温度分布均匀性。在本实验最大流量G=70 mL/s情况下,微通道部分的压降只有10.3 kPa;当冷却器与热源器件界面上的平均温升为25.7 K时,冷却器的散热能力可达730 W,相当于128.5 W/cm^2的界面热流密度。实验结果还验证了Shah和London提出的表观阻力系数关联式、用于预测平均努谢尔数的Sieder-Tate关联式以及Shah&London关联式。A copper-based liquid-flow microchannel heat sink was designed and fabricated to overcome the problems in an existing Diode Laser Array （DLA） cooler. Dense, narrow and short channels instead of the originally designed sparse, wide and long passages are adopted, thus the heat exchange area is considerably enlarged in the limited space and the entrance effects are exploited to enhance the heat transfer, so that the overall cooling capacity is significantly increased and the temperature uniformity over the cooler-DLA interface is improved while maintaining a very low flow resistance, a high flow rate and a low fluid temperature rise. Under the maximum flow rate of 70 mL/s in this experiment, the pressure drop across the channels is only 10.3 kPa; when the average temperature rise of the interface is 25.7 K, the cooling capacity of the heat sink reaches 730 W, corresponding to an interfacial heat flux of 128.5 W/cm^2. The experimental data also verify the Shah ＆ London correlation for predicting the apparent flow friction coefficient, and the Sieder-Tate correlation and the Shah ＆ London correlation for predicting the average Nusselt Number.

关 键 词：微通道 流动阻力 传热特性 激光器热管理 

分 类 号：TK124[动力工程及工程热物理—工程热物理]