纳米结构强化无铅焊点的力学性能  

Mechanical properties of lead-free solder joint containing nano-structured reinforcements

作　　者：刘彬[1] 邰枫[1] 郭福[1] 夏志东[1] 史耀武[1] 

机构地区：[1]北京工业大学材料科学与工程学院,电子组装研究与测试中心,北京100022

出　　处：《复合材料学报》2009年第2期11-17,共7页Acta Materiae Compositae Sinica

基　　金：北京市科技新星计划B类基金(2004B03);霍英东基金(104016)

摘　　要：新型的无铅钎料不仅要具备含铅钎料的工艺性能,更重要的是要有更高的力学性能,特别是焊接接头的抗蠕变能力。将纳米级多面齐聚倍半硅氧烷(Polyhedral oligomeric silsesquioxanes,POSS)颗粒作为增强相添加到基体钎料中,能够有效地改善Sn-3.5Ag基复合钎料的性能。研究了不同种类POSS增强颗粒对Sn-3.5Ag钎料显微组织和力学性能的影响,确定出POSS增强颗粒复合钎料的最佳配比,并对最佳配比复合钎料在不同温度不同载荷条件下的蠕变寿命进行了研究。结果表明:POSS颗粒质量分数小于2%时,可以抑制基板界面处初晶金属间化合物的生长;复合钎料的抗剪切强度明显提高;低温时,最大蠕变寿命明显改善。The newly developed lead-free solders should have good mechanical properties, as well as excellent creep resistance in order to meet the needs of reliability required by electronic industries. Nano-sized polyhedral oligomeric silsesquioxane （POSS） reinforcement particles were incorporated into the promising lead-free solder, Sn- 3. 5Ag, to improve the mechanical property of the lead- free solder. Experimental results show that the thickness of intermetallic compound （IMC） layer between solder and substrate Cu is restrained when the mass fraction of POSS is less than 2%. The composite solders contain different POSS reinforcement types and mass fractions, and their joints possess better mechanical properties. The creep rupture lives are enhanced in the composite solder joint at different temperatures and different stress combinations compared to the Sn - 3.5Ag solder joint, especially at low temperatures.

关 键 词：POSS增强颗粒 显微组织 力学性能 蠕变寿命 

分 类 号：TG425[金属学及工艺—焊接]