球化温度对BGA钎焊球质量的影响  

Influence of Spheroidization Temperature on Quality of BGA Solder Ball

作　　者：郭晓晓[1,2] 闫焉服[1,2] 冯丽芳[1,2] 赵培峰[1] 

机构地区：[1]河南科技大学材料科学与工程学院,河南洛阳471003 [2]河南省有色金属材料科学与加工技术重点实验室,河南洛阳471003

出　　处：《热加工工艺》2009年第9期8-10,共3页Hot Working Technology

基　　金：河南省科技攻关项目(072102260016);"十一五"国家科技支撑计划项目(2006BAF04B14)

摘　　要：钎焊球是BGA及μBGA等高密封装技术中凸点制作关键材料。球化温度是影响钎焊球质量关键因素。本文采用切丝重熔法制作钎焊球,研究了球化温度对63Sn37Pb钎焊球真球度和外观质量的影响。结果表明:在一定球化温度范围内,钎焊球的真球度和表面质量均随着球化温度的升高而变好,但温度接近球化剂沸点时,真球度有所下降。Solder ball is a key material of the bump fabrication in the BGA and μBGA high integrated package. The spheroidization temperature is the main factors to affect the quality of the solder ball. The solder ball was fabricated by the fine wire cutting-remelting method. The influence of spheroidization temperature on the real sphericity and the surface appearance of the solder ball were investigated. Theresults show that the real sphericity and surface appearance of the solder ball become better and better with the spheroidization temperature hoisting within the range of spheroidization temperature. But the real sphericity of the solder ball become smaller when the spheroidization temperature reaches the boiling point of the nodulizer.

关 键 词：钎焊球 63Sn37Pb 球化剂温度 真球度 外观质量 

分 类 号：TG425[金属学及工艺—焊接] TG156