AgCuCe/TU1层状复合材料扩散退火工艺研究  

The Study on Diffusion Annealing Process of AgCuCe/TU1 Laminated Composites

作　　者：乔勋[1] 王健[1] 周世平[1] 贺晓燕[1] 李林修 

机构地区：[1]昆明贵金属研究所贵研铂业股份有限公司,云南昆明650106

出　　处：《贵金属》2009年第2期9-13,共5页Precious Metals

基　　金：云南省科研院所技术开发专项基金资助(2006KFZX-13)

摘　　要：用室温固相轧制复合法制备了AgCuCe/TU1层状复合材料,研究了不同扩散退火工艺对AgCuCe/TU1界面结合性能的影响,测定了复合材料复层和基体的硬度,观察了试样的界面微观组织。结果表明:600℃/0.5h扩散退火可以改善界面结合状态和界面附近组织形貌,获得充分的再结晶组织和致密的界面结合状态;700℃/0.5h扩散退火在界面处形成细晶区和孔洞;750℃/0.5h扩散退火使AgCuCe/TU1在界面处形成氧化物夹杂,严重损害界面结合性能。The AgCuCe/TU1 laminated composites were prepared by solid roll -bonding process at room temperature. The influence of different diffusion annealing process on the AgCuCe/TU1 interfaeial bond- ing properties was studied, and the hardness of TU1 and AgCuCe were determined and the interfacial morphology was also observed. It was found that the interface bonding states and reerystallized microstrueture are improved by annealing at 600 ℃/0.5 h; Fine - grain regions and cavities could be formed on the AgCuCe/TU1 interfaces by annealing at 700 ℃/0.5 h; The annealing at 750 ℃/0.5 h causes the formation of oxide inclusions on interfaces of AgCuCe/TU1, resulting in the weakness of the interface bonding states.

关 键 词：金属材料 复合材料 扩散退火 界面 显微组织 

分 类 号：TG146.325[一般工业技术—材料科学与工程]