信号传输高频化和高速数字化对PCB的挑战(3)——对导线电磁干扰的影响和出路  

The Challenge of Signal Transmission in High Frequency and High Speed Digitization(3)——The Impact of EMI on Traces and the Way of Resolving

作　　者：林金堵[1] 

机构地区：[1]CPCA

出　　处：《印制电路信息》2009年第5期6-9,69,共5页Printed Circuit Information

摘　　要：文章概述了高频化和高速数字化信号传输的PCB设计基本措施。The paper describes that the basic measure of PCB design in signal transmission of high frequency and high-speed digitization.

关 键 词：PCB设计 传输信号 高频化和高速数字化 电磁干扰 差分线 短线和无线结构 

分 类 号：TN41[电子电信—微电子学与固体电子学]