有机硅在环氧包封料、灌封料中的应用  

Application of Silicone to Epoxy Encapsulating Materals and Potting Compound

作　　者：高卫国 郭强 张艳飞 张建 

机构地区：[1]天津市凯华绝缘材料有限公司,天津300300

出　　处：《绝缘材料》2009年第2期26-28,32,共4页Insulating Materials

基　　金：天津市科技攻关计划资助项目(06YFGPGX07500)

摘　　要：介绍了有机硅在环氧包封料、灌封料中的应用。借助于有机硅良好的低表面能、耐热、耐候、阻燃、憎水等性能来改善环氧包封、灌封料,解决其防潮、阻燃及耐冷热循环不佳的问题。实验表明,有机硅在改善产品性能方面应用前景广阔,是值得深入探索的领域。The applications of silicone in epoxy encapsulating materials and potting compound were introduced in this review. Adding of silicone with properties like low surface energy, heat resistance, weathering resistance, flame retardance and hydrophobility in encapsulating material and potting compound can solve the problems of the materials in water repellency, flame retardance and thermal shock resistance. It was concluded that silicone is applicable to epoxy compounds and worth developing further.

关 键 词：有机硅 环氧树脂 包封料 灌封料 

分 类 号：TM209[一般工业技术—材料科学与工程] TM211[电气工程—电工理论与新技术]