SiC_p/101Al复合材料电子束焊接接头温度场对其显微组织的影响  

Effects of Electron Beam Welding Temperature Field on Microstructure of SiC_p/101Al Composite Joint

作　　者：季小辉[1] 王少刚[1] 董桂萍[1] 

机构地区：[1]南京航空航天大学材料科学与技术学院,江苏南京210016

出　　处：《机械工程材料》2009年第5期97-100,共4页Materials For Mechanical Engineering

基　　金：江苏省自然科学基金资助项目(BK2002094)

摘　　要：采用ANSYS有限元分析软件对SiCp/101Al复合材料电子束焊接时接头的温度场进行了数值模拟,在此基础上对接头显微组织中Al4C3脆性相生成数量进行了分析。结果表明:采用双椭球热源模型可准确地模拟出电子束焊接接头的温度场;焊接时表面熔池近似为圆形,内部呈上宽下窄的锥形;在保证接头焊透的前提下,适当提高焊接速度或减小电子束输入功率,可在一定程度上减少接头组织中Al4C3脆性相的数量。The temperature field in electron beam welding of SiCp/101Al composite was numerically simulated by the ANSYS finite element analysis software, and the quantity of Al4C3 brittle phases in the joint was analyzed. The results show that the temperature distribution of electron beam welding could be accurately simulated by double ellipsoidal heat source model. The surface of welding pool showed circular distribution, and the inside showed conical distribution. Moreover, the quantity of Al4C3 brittle phase in welded joint could be greatly reduced by increasing the welding speed or decreasing the input power of electron beam when penetration joint was got.

关 键 词：铝基复合材料 电子束焊接 数值模拟 温度场 

分 类 号：TG456.3[金属学及工艺—焊接]