脉冲电镀Ag-Sb合金的研究  

Study of Ag Sb Alloy Pulse Electroplating

作　　者：向国朴[1] 王萍[1] 

机构地区：[1]天津大学应化系

出　　处：《电镀与精饰》1998年第1期4-8,共5页Plating & Finishing

摘　　要：研究了脉冲参数对Ａｇ－Ｓｂ合金镀层中Ｓｂ含量和硬度的影响。比较了脉冲电流和直流电流电镀Ａｇ－Ｓｂ合金镀层的孔隙率、结合力、耐磨性和硬度等。应用Ｘ－射线和电镜扫描分析了镀层的结构和形貌。The effects of pulse plating parameters on the content of Sb in Ag Sb alloy and the hardness of deposits were studied in this paper. The PC and DC platings of Ag Sb alloy were also compared on such respects as porosity, adhesive force, wear resistance and hardness of deposits. With the aids of x ray diffraction and scanning electron microscope photos, the structure and morphology of deposits were analysed.

关 键 词：脉冲电镀 电镀 镀合金 镀层 银锑合金 

分 类 号：TQ153.2[化学工程—电化学工业]