半固态AlSi15Cu3MgFe合金铸件触变充型过程的数值模拟  

Simulation on Semi-Solid Thixo-Filling of AlSi15Cu3MgFe Alloy Casting

作　　者：闫淑芳[1] 陈伟东[1] 刘向东[1] 

机构地区：[1]内蒙古工业大学材料科学与工程学院,内蒙古呼和浩特010051

出　　处：《铸造》2009年第5期458-461,共4页Foundry

摘　　要：在充分考虑半固态AlSi15Cu3MgFe合金触变过程中压力和速度变化特征的基础上,确定模拟计算所需要的基本方程、边界条件以及表观粘度的数学模型,并建立耦合表观粘度的充型模拟方程,计算并分析比较半固态铝合金平板件以及液态铝合金平板件的触变充型过程。结果表明,由于半固态表观粘度随剪切速率增大而下降,从而使半固态铝合金呈现剪切变稀的触变流动特点。最后对两个典型半固态铝合金铸件成形过程进行了模拟计算,进一步验证了半固态金属充型过程的平稳性。Based on the changing characters of pressure and flow velocity during filling process of semi-solid AISi15Cu3MgFe slurry, the equation, boundary conditions and mathematical model of apparent viscosity were confirmed, and the mold filling equation coupled with the apparent viscosity was established. The flowing and filling characteristics of the semi-solid aluminum alloy were compared with the liquid aluminum alloy. The results indicate that apparent viscosity decreases with the increase of shear rate, so semi-solid alloy shows shearing thinning thixotropy. The steady filling process of semi-solid aluminum alloy is validated by the simulation on semi-solid thixofilling for the two representative semi-solid aluminum castings.

关 键 词：半固态 充型模拟 表观粘度 

分 类 号：TG249.9[金属学及工艺—铸造]