数控选区电化学沉积快速成型补偿量研究  

Study on Compensation Rate of Selective Electroforming Rapid Prototyping

作　　者：梁天长[1] 李湘生[1] 黎建军[1] 

机构地区：[1]浙江理工大学机械与自动控制学院,杭州310018

出　　处：《浙江理工大学学报（自然科学版）》2009年第3期379-383,共5页Journal of Zhejiang Sci-Tech University(Natural Sciences)

基　　金：浙江省自然科学基金(Y105418)

摘　　要：选区电化学沉积快速成型是一种新的金属快速成型工艺,有必要对工艺关键补偿量进行研究。以硫酸铜溶液为介质,建立电化学沉积模型,并对补偿量影响因素进行了研究。利用测量投影仪测量不同工况下获得的沉积斑点,得到阴阳极间隙、阳极头面积、电流密度、运动速度等对补偿量大小的影响规律,并得到适合数控选区电化学沉积快速成型的补偿量及对应的工艺参数。Selective electroforming is a new direct rapid prototyping technology of metal. It is necessary to study compensation rate which is the key problem of the selective electroforming. The experimental study on distributing model of deposit and effects on compensation rate are carried out with the copper sul- fate solution as the working substance. The compensation rate is measured in different working conditions by measuring projector. The diameter of anode, the distance of cathode and anode, the current density, and scanning velocity effect on compensation rate are invest aged, the appropriate compensation rate and the process parameters for selective electroforming are found.

关 键 词：电化学沉积 快速成型 补偿量 离子运动轨迹线 

分 类 号：TQ153.4[化学工程—电化学工业]