环氧塑封料中填充剂的作用和发展  

Effect and Development of Filler in Epoxy Molding Compound

作　　者：曹延生[1] 黄文迎[1] 

机构地区：[1]北京科化新材料科技有限公司,北京102206

出　　处：《电子与封装》2009年第5期5-10,43,共7页Electronics & Packaging

摘　　要：环氧塑封料占据整个半导体封装市场的90%左右,而填充剂含量占环氧塑封料的60%～90%,因此填充剂的性能直接影响环氧塑封料的加工性能、机械性能、导热性能和半导体器件的封装工艺性能、导热性能、可靠性能等。另外,当今社会电子技术日新月异,集成电路正向着超大规模、超高速、高密度、大功率、多功能、绿色环保化的方向发展,因此对环氧塑封料的性能要求愈来愈高,相应的填充剂性能也有了许多新的要求,并且也出现了许多新型填充剂。文中详细地介绍了环氧塑封料中填充剂的作用,各种填充剂对环氧塑封料和封装器件的性能影响以及环氧塑封料中填充剂的分类和发展。Epoxy molding compound （EMC） has been used on about 90% of the semiconductor packages, the amount of filler used in the epoxy molding compound was about 60%-90%, so the influence of filler property on processing, mechanical property, thermal conductivity of epoxy molding compound and technical property of packaging, thermal conductivity, reliability of semiconductor. In additional, nowadays, electronics changed very quickly, integrated circuit was developing rapidly towards super scale, hypervelocity, high density, high power, multifunction, environment friendly, the property of epoxy molding compound was required to become better and better, so advanced property demanded for filler was required, and some new fillers which were used in epoxy molding compound were found. The effect of different filler in epoxy molding compound, the influence of filler on properties of epoxy molding compound and package of electronic components, the sort and development of filler in epoxy molding compound were introduced.

关 键 词：环氧塑封料 填充剂 集成电路 封装 

分 类 号：TN305.94[电子电信—物理电子学]