Cu-Fe原位复合材料的研究现状和发展趋势  

Research Situation and Developmental Tendency of Cu-Fe In-situ Composites

作　　者：黄华[1,2] 陈拂晓[1,2] 刘平[3] 

机构地区：[1]河南科技大学材料科学与工程学院,河南洛阳471003 [2]河南省有色金属材料科学与加工技术重点实验室,河南洛阳471003 [3]上海理工大学电功能材料研究所,上海200093

出　　处：《热加工工艺》2009年第10期114-117,共4页Hot Working Technology

摘　　要：形变铜基原位复合材料具有的高强度、高导电率的突出特点使其成为具有广泛应用潜力的结构功能材料。对Cu-Fe系形变原位复合材料的制备工艺、强化机理、导电率以及该类材料的研究现状进行了介绍,并展望了其发展趋势。As a function material with great application potential, deformation processed copper-based in-situ composite （DPCC）, which had ultrahigh strength coupled with good conductivity, was widely used in the modem industry. Research situation of Cu-Fe in-situ composite, which belongs to the DPCC, was introduced. Their fabrication processes, strengthening mechanism and electric conductivity of the material were introduced. The developmental tendency of Cu-Fe in-situ composite was also presented.

关 键 词：铜基原位复合材料 Cu-Fe 强化机理 导电率 

分 类 号：TB331[一般工业技术—材料科学与工程]