电弧离子镀QTi2.5/Cu镀层组织与性能分析  

Study on Microstructure and Properties of QTi2.5/Cu Films Prepared by Arc Ion Plating

作　　者：郝俊丽[1] 侯文义[2] 袁庆龙[2,3] 

机构地区：[1]太原理工大学材料科学与工程学院,山西太原030024 [2]太原理工大学机械工程学院,山西太原030024 [3]河南理工大学材料科学与工程学院,河南焦作454000

出　　处：《热加工工艺》2009年第10期139-141,144,共4页Hot Working Technology

基　　金：山西省回国留学人员科研资助项目(2007-34)

摘　　要：在磁控条件下进行QTi2.5/Cu同基合金离子镀试验,用TEM、EDS、XRD和数显显微硬度计以及球磨机对镀层结构、截面和表面的化学成分、相结构、显微硬度及耐磨损性能进行了测定。结果表明:镀层由沉积层和过渡层构成,近表面为层片状组织;镀层中Ti含量由表至里逐渐降低。镀层显微硬度呈梯度分布,镀层硬度(三点取平均值)约为铜基材的2倍。表面层耐磨损性能得到明显改善。The QTi2.5 films were deposited on the Cu substrate by arc ion plating under the magnetron condition. The microstructure, chemical component of the cross-section and surface, phase structure and microhardness, wear resistance of the films were studied by TEM, XRD, digital micro-hardness tester （401MVD） and a pin-on-disc wear tester（BDM-3）, respectively. The results show that the films are composed of the deposited layer and the transition layer, there are laminate structures near the surface, and the Ti content gradually decreases from the surface to the internal. The microhardness of the deposited layer present the grads, the microhardness of the deposited layer is approximately two times compared to the substrate＇s. And the wear resistance of the surface improves.

关 键 词：离子镀 Cu-Ti合金 镀层组织 磨损性能 

分 类 号：TG174.444[金属学及工艺—金属表面处理]