碳化硅铝合金材料触变成形电子封装壳体研究  

Study on the thixoforming of electronic packaging shell with SiC_P and Al alloy

作　　者：马春梅[1] 王开坤[1] 徐峰[1] 杨荃[2] 张崎 

机构地区：[1]北京科技大学材料科学与工程学院,北京100083 [2]高效轧制国家工程研究中心,北京100083 [3]华东微电子技术研究所,安徽合肥230022

出　　处：《电子元件与材料》2009年第6期60-63,共4页Electronic Components And Materials

基　　金：国家"863"计划资助项目(No.2007AA03Z119);中电集团第四十三研究所创新基金资助项目(No.81AA10042);北京市自然科学研究基金资助项目(No.2072012);兰州理工大学有色金属合金及加工教育部重点实验室开放基金

摘　　要：采用有限元软件DEFORM-3DTM,开发了热力耦合触变成形电子封装壳体模拟模型,模拟了SiCp/A356(铝合金)复合材料电子封装壳体的成形过程。对触变成形过程中坯料流动速度、等效应变和温度分布进行了分析,并对可能产生的成形缺陷进行了预测。结果发现,使用半固态触变成形技术可成形SiCp/A356复合材料电子封装壳体,在挤压速度为100mm/s、坯料温度为580℃时,能够较好地满足电子封装壳体尺寸的要求,但成形过程中常伴有低于半固态温度的热加工现象出现。A thermo-mechanical coupling simulation model was developed with DEFORM-3DTM and the thixoforming process of SiCp/A356 composite electronic packaging shell was simulated using this model. The flow velocity, equivalent strain and temperature distribution of slurry were analyzed and the potential defects formed in the thixoforming process were predicted. The results show that the semi-solid thixoforming technology can be used to prepare SiCp/A356 composite electronic packaging shell; And, when the extrusion speed is 100 mm/s and the slurry temperature is 580℃, a high dimension accuracy can be achieved for electronic packaging shell; However, the temperature distribution indicates that hot working below the semi-solid temperature is always present in the thixoforming process.

关 键 词：电子封装壳体 触变成形 SiCp/A356复合材料 模拟 

分 类 号：TM931[电气工程—电力电子与电力传动]