Parameter fitting of constitutive model and FEM analysis of solder joint thermal cycle reliability for lead-free solder Sn-3.5Ag  

作　　者：周萍 胡炳亭 周孑民 杨莺 

机构地区：[1]School of Energy Science and Engineering,Central South University

出　　处：《Journal of Central South University》2009年第3期339-343,共5页中南大学学报（英文版）

基　　金：Project(50376076) supported by the National Natural Science Foundation of China

摘　　要：The experimental tests of tensile for lead-flee solder Sn-3.5Ag were performed for the general work temperatures range from 11 to 90 ℃ and strain rate range from 5 × 10^-5 to 2 × 10^-2s^-1, and its stress--strain curves were compared to those of solder Sn-37Pb. The parameters in Anand model for solder Sn-3.5Ag were fitted based on experimental data and nonlinear fitting method, and its validity was checked by means of experimental data. Furthermore, the Anand model was used in the FEM analysis to evaluate solder joint thermal cycle reliability. The results show that solder Sn-3.5Ag has a better creep resistance than solder Sn-37Pb. The maximum stress is located at the upper right comer of the outmost solder joint from the symmetric center, and thermal fatigue life is predicted to be 3.796 × 10^4 cycles under the calculated conditions.The experimental tests of tensile for lead-free solder Sn-3.5Ag were performed for the general work temperatures range from 11 to 90 ℃ and strain rate range from 5×10-5 to 2×10-2 s-1, and its stress—strain curves were compared to those of solder Sn-37Pb. The parameters in Anand model for solder Sn-3.5Ag were fitted based on experimental data and nonlinear fitting method, and its validity was checked by means of experimental data. Furthermore, the Anand model was used in the FEM analysis to evaluate solder joint thermal cycle reliability. The results show that solder Sn-3.5Ag has a better creep resistance than solder Sn-37Pb. The maximum stress is located at the upper right corner of the outmost solder joint from the symmetric center, and thermal fatigue life is predicted to be 3.796×104 cycles under the calculated conditions.

关 键 词：lead free solder Sn-3.5Ag alloy Sn-37Pb alloy constitutive model TENSILE FEM analysis thermal cycle reliability 

分 类 号：TN05[电子电信—物理电子学]