GH169 合金显微组织对合金裂纹扩展速率的影响  

Effect of Microstructures on Crack Propagation Rate of GH169 Alloy

作　　者：李树祺[1] 庄景云[1] 谢锡善[2] 李兵[2] 

机构地区：[1]钢铁研究总院 [2]北京科技大学

出　　处：《材料工程》1998年第5期26-27,共2页Journal of Materials Engineering

摘　　要：对四种工艺（普通工艺、高强工艺、直接时效工艺、超细晶工艺）的ＧＨ１６９合金的力学性能和６５０℃裂纹扩展速率进行了测试和对比分析。结果表明：晶粒细化和适量的颗粒状、短棒状δ相在晶界析出使合金６５０℃持久塑性明显提高，使合金６５０℃在纯蠕变和以蠕变损伤为主的疲劳－蠕变交互作用条件下具有最低的裂纹扩展速率。Analysis of mechanical properties and crack propagation rates determination on standard, high strength, direct age and ultra fine grain treated GH169 alloy have been done. The results show that grain refining and granular,δphase precipitation at grain boundaries can increase stress rupture ductility at 650℃ and has the lowest crack propagation rate in the condition of creep and creep/fatigue interaction mainly within creep damage.

关 键 词：高温合金 超细晶 裂纹扩展速率 显微组织 

分 类 号：TG133.32[一般工业技术—材料科学与工程] TG111.91[金属学及工艺—合金]