Effects of cerium on Sn-Ag-Cu alloys based on finite element simulation and experiments  

作　　者：张亮 薛松柏 陈燕 韩宗杰 王俭辛 禹胜林 卢方焱 

机构地区：[1]College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics [2]Harbin Welding Institute [3]The 14th Research Institute, China Electronics Technology Group Corporation

出　　处：《Journal of Rare Earths》2009年第1期138-144,共7页稀土学报（英文版）

摘　　要：Effect of small addition of rare earth on Sn-Ag-Cu solder was investigated by finite element method based on creep model of low stress and high stress and experiments respectively.It was found that addition of rare earths evidently improved the resistance to creep deformation of the solder, so that the reliability of Sn-Ag-Cu-Ce solder joint could be improved remarkably.Mechanical testing and microstructural analysis results showed that, mechanical properties of alloys bearing Ce were better than that of the original alloy, and the optimum content of Ce was about 0.03wt.%.After aging intermetallic compound between solder joint and Cu substrate was observed and analyzed by X-ray diffraction（XRD）, scanning electron micrographs（SEM） and energy dispersive X-ray fluorescence spectrometer（EDX）.Results showed that the thickness of intermetallic compound layer would became thinner when the addition of Ce was about 0.03wt.%, and the grains of intermetallic compound became finer, and the microstructure was more homogeneous than that in the original Sn-Ag-Cu/Cu interface.Effect of small addition of rare earth on Sn-Ag-Cu solder was investigated by finite element method based on creep model of low stress and high stress and experiments respectively.It was found that addition of rare earths evidently improved the resistance to creep deformation of the solder, so that the reliability of Sn-Ag-Cu-Ce solder joint could be improved remarkably.Mechanical testing and microstructural analysis results showed that, mechanical properties of alloys bearing Ce were better than that of the original alloy, and the optimum content of Ce was about 0.03wt.%.After aging intermetallic compound between solder joint and Cu substrate was observed and analyzed by X-ray diffraction（XRD）, scanning electron micrographs（SEM） and energy dispersive X-ray fluorescence spectrometer（EDX）.Results showed that the thickness of intermetallic compound layer would became thinner when the addition of Ce was about 0.03wt.%, and the grains of intermetallic compound became finer, and the microstructure was more homogeneous than that in the original Sn-Ag-Cu/Cu interface.

关 键 词：creep model cerium reliability intermetallic compound tensile strength rare earths 

分 类 号：TG146.14[一般工业技术—材料科学与工程]