NdFeB磁性材料化学镀Ni-Cu-P合金沉积机理研究  

Research on depositing mechanism of electroless Ni-Cu-P plating on NdFeB permanent magnet materials

作　　者：王憨鹰[1,2] 陈焕铭[2] 徐靖[2] 孙安[2] 

机构地区：[1]榆林学院物理与电气工程系,陕西榆林719000 [2]宁夏大学物理电气信息学院,宁夏银川750021

出　　处：《兵器材料科学与工程》2009年第1期50-53,共4页Ordnance Material Science and Engineering

基　　金：宁夏高等学校科学研究项目(200513)

摘　　要：通过对不同时间序列(0.5、1、10、20、40、60min)镀层的深入研究,提出Ni-Cu-P非晶态合金镀层形核与长大过程的沉积模型,并对不同时间序列非晶态合金镀层的形貌和结构研究表明:在施镀初期,Ni、Cu原子团优先沉积于基体表面能量较高的部位,并开始形核且以不规则形态长大;在施镀后期,随着P含量的不断增加,镀层形貌逐渐由不规则形态变为规则胞状形态,直至形成光滑平整的非晶态镀层。Based on the investigation of depositing process with different time series （0.5,1,10,20,4U,OU ram）, the deposition model of Ni-Cu-P amorphous coatings during nucleation and growth was put forward, the investigation on morphology and structure of the amorphous alloy coatings prepared with different time series suggested that in the early plating stages, Ni and Cu atom clusters preferably deposited on position with higher surface energy, then the nuclei were formed and grew up along the matrix surface with irregular shape; in the late plating stages, coatings morphology changed from irregular shape into regular nodules shape gradually with the P content increasing, until the mirror-like amorphous alloy coatings were formed.

关 键 词：化学镀 NI-CU-P合金 沉积过程 优先沉积 非晶态镀层 

分 类 号：TQ153.12[化学工程—电化学工业]