大功率白光LED封装技术可靠性研究  

Reasearch on Encapsulation Technology Reliability of High Power White-Light LED

作　　者：(Ledman Optoelectronic Co.,Shenzhen 518108,China) 

机构地区：[1]深圳雷曼光电科技有限公司

出　　处：《现代显示》2009年第6期50-52,共3页Advanced Display

摘　　要：首先介绍了大功率白光LED封装的前景和其主要功能,然后对大功率白光LED封装的关键技术,包括荧光胶封装工艺、外封胶选取、大尺寸晶片封装、可靠性测试与评估方面做了阐述。并对光斑改善和光通量提高做了一些具体的研究。The package prospects and the main function of high power white-light LED are introduced firstly in this paper. And then, the key technology of high power white-light LED package is explained, which including fluorescent coating packaging technology, selecting the sealed silicone, packaging of large-size chip, reliability testing and evaluation, also some detailed researches on meliorating the light spot and improving luminous have been done.

关 键 词：大功率白光LED 封装工艺可靠性 光斑 光通量 

分 类 号：TN312.8[电子电信—物理电子学]