Sn-3.5Ag-2Bi-1.5In无铅焊料压入蠕变性能的研究  

Investigation of Indentation Creep Behavior of Sn-3.5Ag-2Bi-1.5In Lead-Free Solder

作　　者：陈正周[1] 曾明[2] 沈保罗[2] 廖春丽[1] 

机构地区：[1]西华大学,四川成都610039 [2]四川大学,四川成都610065

出　　处：《稀有金属材料与工程》2009年第A01期86-90,共5页Rare Metal Materials and Engineering

摘　　要：研究得出了Sn-3.5Ag-2Bi-1.5In无铅焊料压入蠕变的应力指数n=3.246,蠕变激活能Q=59.74kJ/mol和材料的结构常数A=0.307,从而导出了Sn-3.5Ag-2Bi-1.5In无铅焊料的压入蠕变的稳态蠕变速率的本构方程■=0.307σ3.246exp(-59740/RT)。与此同时还绘制出了压入蠕变的位移量与加载时间变化关系的曲线和压入蠕变速率图,总结了Sn-3.5Ag-2Bi-1.5In无铅焊料的压入蠕变随温度和应力的变化规律。通过对其蠕变前后的微观结构和组织的变化分析,探讨了蠕变塑性变形机制。Through the Sn-3.5Ag-2Bi-1.5In lead-free solder indentation creep of stress exponent n=3.246, creep activation energy Q=59.74 （kJ/mol） and the structure constant of material A=0.307 were obtained, from the results the constitutive equation of the steady-state creep rate ε=0.307,σ^3.246exp（-59740/RT） was inferred. At the same time the curve of the relationship between the indentation creep displacement and the loading time and the indentation creep rate map were given. It is summed up in the law that the Sn-3.5Ag-2Bi-1.5In lead-free solder indentation creep changes with varieties of stress and temperature. By analysis of changes of the micro-structure and organization before creep and after creep, the creep plastic deformation mechanism was explored.

关 键 词：Sn-3.5Ag-2Bi-1.5In无铅焊料 压入蠕变 应力指数:激活能 微观组织 

分 类 号：TG421[金属学及工艺—焊接]