金属钨箔膜的制备研究进展  

Progress of Tungsten Foil Fabrication

作　　者：宋萍[1,2] 邢丕峰[1] 谌家军[2] 李朝阳[1] 谢军[1] 易泰民[1] 林华平[1,2] 

机构地区：[1]中国工程物理研究院,四川绵阳621900 [2]西华师范大学,四川南充637002

出　　处：《稀有金属材料与工程》2009年第A01期382-386,共5页Rare Metal Materials and Engineering

基　　金：国家"863"计划项目

摘　　要：具有体密度的高表面质量金属钨薄膜对材料高压状态方程研究具有十分重要的意义。综述了钨箔膜制备的几种方法,包括化学气相沉积、物理气相沉积、机械轧制、机械研磨抛光、化学抛光和电解抛光。综合比较后认为,采用电解抛光法可以基本满足状态方程靶用钨箔膜的需要。电解抛光可以制备表面质量比较高,厚度最小可达几微米的金属箔材,密度与原料相同,而且不会产生内应力、表面硬化、表面沾污问题,是制备低表面粗糙度、具有块材组织结构和密度材料的一种重要手段。Tungsten foil with theoretical density plays an important role in the Equation of state of materials under ultra high pressure research. In this paper, current preparative techniques of Tungsten thin-film were summarized, including chemical vapor deposition（CVD）, physical vapor deposition（PVD）, mechanical lapping polishing, chemical mechanical lapping polishing, electropolishing. Comparing these preparative techniques, Electropolishing was the best one to satisfy the need of the Equation of state of materials. As there was no residual stress, no surface harding or surface contamination etc by electropolishing technique, it was the best suitable preparation approach.

关 键 词：钨箔膜 制备技术 表面粗糙度 电解抛光 

分 类 号：TB383.2[一般工业技术—材料科学与工程]