时效及冷变形对Cu-5.2Ni-1.2Si合金组织和性能的影响  

Effect of Aging and Cold Deforming on Microstructure and Performance of Cu-5.2Ni-1.2Si Alloy

作　　者：潘志勇[1,2] 汪明朴[1] 李周[1] 肖柱[1] 贾延琳[1] 

机构地区：[1]中南大学,湖南长沙410083 [2]有色金属材料科学与工程教育部重点实验室,湖南长沙410083

出　　处：《稀有金属材料与工程》2009年第A01期485-489,共5页Rare Metal Materials and Engineering

基　　金：教育部博士点基金(20040533069);湖南省自然科学基金(05JJ30095)

摘　　要：利用力学性能、电学性能测量、金相、电镜观察及电子衍射分析研究了时效及冷变形对Cu-5.2Ni-1.2Si合金硬度和电导率的影响规律。结果表明:时效前的冷变形可以加速时效析出过程,在时效初期尤为明显;Cu-5.2Ni-1.2Si合金冷轧80%在450℃时效15min,其硬度可以达到3.02GPa,其相对电导率达到53.8%IACS;合金的强化机制为Orowan位错绕过机制;合金的导电率与析出相的体积分数之间存在线性关系。Effect of aging and cold deforming on microstructure and performance of Cu-5.2Ni-1.2Si alloy was studied by the mechanics performance test, the electricity performance test, metallographic test, SEM, TEM and energy spectrum analysis. The result indicated that, the cold deforming before aging may accelerate the process of aging precipitation, especially in initial period of aging; the hardness of Cu-5.2Ni-1.2Si alloy, aging for 15 rain in 450 ℃ after cold rolling 80%, may achieve to 3.02 GPa, and its relative conductivity achieves to 53.8%IACS; the alloy strengthened mechanism is the Orowan dislocation bypassed mechanism; it has the linear relations between the alloy relative conductivity and the volume score of precipitation.

关 键 词：Cu-5.2Ni-1.2Si合金 时效 冷变形 硬度 导电率 

分 类 号：TG131[一般工业技术—材料科学与工程]