铝合金Ni-Co-P合金电镀工艺优化  

Optimization of Electroplating Process for Ni-Co-P Alloy Coating on Aluminum Alloy Substrate

作　　者：李赟[1] 方亮[1] 罗方清 

机构地区：[1]重庆大学应用物理系,重庆400044 [2]重庆建设车用空调器有限责任公司,重庆400052

出　　处：《材料保护》2009年第6期42-46,共5页Materials Protection

基　　金：重庆市科技攻关项目(CSTC-2005AA4006-A6)

摘　　要：在铝及其合金表面沉积Ni或Ni基合金,可以提高基体表面的硬度和耐磨性。通过正交试验,研究了铝硅合金基体上电镀Ni-Co-P镀层的工艺,得到了电流密度、镀液温度、pH值、电镀时间、镀液成分对镀层厚度、硬度、成分和沉积速率的影响规律,同时,还考察了镀层的耐磨性。结果表明:延长电镀时间、提高镀液温度和pH值时,镀层厚度和镀层硬度均增大;提高电流密度时,镀层厚度增大,但镀层硬度减小。提高电流密度、升高温度和提高pH值时,沉积速率增大。Orthogonal tests were carried out to investi-gate the process for electroplating of Ni-Co-P alloy coating on hy-per-eutectic Al-Si cast alloy.The effects of electric current den-sity,temperature,plating time,and pH value and component of electroplating bath on the thickness,hardness and deposition rate of Ni-Co-P coating were explored.And the wear resistance of the Ni-Co-P coating was evaluated.It was found that the thickness and hardness of electroplated Ni-Co-P coating increased with in-creasing plating time or temperature and pH value of the plating bath.The thickness of the coating increased with increasing cur-rent density,but its hardness decreased therewith.Moreover,the deposition rate of the Ni-Co-P coating increased with increasing current density or temperature and pH value of the plating bath.

关 键 词：电镀 Ni—Co—P合金 铝合金 工艺优化 耐磨性 

分 类 号：TQ153.2[化学工程—电化学工业]