覆层技术发展现状及其在制备铜基电触头材料中的应用  

The Current Situation and Application of Cladding Technology in the Copper Based Electrical Contact Materials

作　　者：杜志敏[1] 王俊勃[1] 付翀[1] 畅巍[1] 刘英[1] 

机构地区：[1]西安工程大学机电学院,西安710048

出　　处：《电工材料》2009年第2期30-34,共5页Electrical Engineering Materials

基　　金：陕西省科学技术研究发展计划项目(2008K06-12)

摘　　要：材料表面处理技术是目前材料科学的前沿领域,采用该技术可在一些表面性能差或廉价基材表面形成合金层,以取代昂贵的整体合金,降低成本。本文综述了覆层技术和等离子喷涂技术用于纳米覆层的研究现状,对比分析了各种技术的优缺点,展望了铜基覆层纳米AgSnO2电触头材料的发展趋势。Material surface treatment technology is current materials science frontiers, using this technique can in some poor or the surface properties of surface alloy material cheap, to replace expensive whole alloy and reduce the cost. Review the cladding technology and plasma spraying technology used in nanotechnology research status of cladding are introduced in this paper. The advantages and disadvantages of every kind of technology are compared and analyzed. The development trend of cladding Nano-AgSnO2-containing copper-base electrical contact material is prospected.

关 键 词：覆层 AGSNO2 铜基电触头材料 纳米 

分 类 号：TM205.1[一般工业技术—材料科学与工程]